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    Design of Electrothermally Compliant MEMS With Hexagonal Cells Using Local Temperature and Stress Constraints

    Source: Journal of Mechanical Design:;2009:;volume( 131 ):;issue: 005::page 51006
    Author:
    Rajat Saxena
    ,
    Anupam Saxena
    DOI: 10.1115/1.3087544
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, meso- and microscale electrothermally compliant mechanical systems are synthesized for strength, with polysilicon as the structural material. Local temperature and/or stress constraints are imposed in the topology optimization formulation. This is done to keep the optimal solutions thermally intact and also to keep the local stresses below their allowable limit. Constraint relaxation performed on both temperature and stress constraints allows them to be ignored when the cell material densities approach their nonexisting states. As both local constraints are large in number with the number of cells, an active constraint strategy is employed with gradient based optimization. Honeycomb parametrization, which is a staggered arrangement of hexagonal cells, is used to represent the design region. This ensures at least an edge connection between any two adjacent cells, and thus prevents the appearance of both checkerboard and point flexure singularities without any additional computational load. Both SIMP and SIGMOID material assignment functions are explored to obtain the optimal solutions.
    keyword(s): Temperature , Stress , Design , Optimization , Topology , Displacement AND Microelectromechanical systems ,
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      Design of Electrothermally Compliant MEMS With Hexagonal Cells Using Local Temperature and Stress Constraints

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    http://yetl.yabesh.ir/yetl1/handle/yetl/141395
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    contributor authorRajat Saxena
    contributor authorAnupam Saxena
    date accessioned2017-05-09T00:34:24Z
    date available2017-05-09T00:34:24Z
    date copyrightMay, 2009
    date issued2009
    identifier issn1050-0472
    identifier otherJMDEDB-27898#051006_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/141395
    description abstractIn this paper, meso- and microscale electrothermally compliant mechanical systems are synthesized for strength, with polysilicon as the structural material. Local temperature and/or stress constraints are imposed in the topology optimization formulation. This is done to keep the optimal solutions thermally intact and also to keep the local stresses below their allowable limit. Constraint relaxation performed on both temperature and stress constraints allows them to be ignored when the cell material densities approach their nonexisting states. As both local constraints are large in number with the number of cells, an active constraint strategy is employed with gradient based optimization. Honeycomb parametrization, which is a staggered arrangement of hexagonal cells, is used to represent the design region. This ensures at least an edge connection between any two adjacent cells, and thus prevents the appearance of both checkerboard and point flexure singularities without any additional computational load. Both SIMP and SIGMOID material assignment functions are explored to obtain the optimal solutions.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDesign of Electrothermally Compliant MEMS With Hexagonal Cells Using Local Temperature and Stress Constraints
    typeJournal Paper
    journal volume131
    journal issue5
    journal titleJournal of Mechanical Design
    identifier doi10.1115/1.3087544
    journal fristpage51006
    identifier eissn1528-9001
    keywordsTemperature
    keywordsStress
    keywordsDesign
    keywordsOptimization
    keywordsTopology
    keywordsDisplacement AND Microelectromechanical systems
    treeJournal of Mechanical Design:;2009:;volume( 131 ):;issue: 005
    contenttypeFulltext
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