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    Examining Interfacial Diffuse Phonon Scattering Through Transient Thermoreflectance Measurements of Thermal Boundary Conductance

    Source: Journal of Heat Transfer:;2009:;volume( 131 ):;issue: 004::page 43207
    Author:
    Pamela M. Norris
    ,
    Patrick E. Hopkins
    DOI: 10.1115/1.3072928
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Today’s electronic and optoelectronic devices are plagued by heat transfer issues. As device dimensions shrink and operating frequencies increase, ever-increasing amounts of thermal energy are being generated in smaller and smaller volumes. As devices shrink to length scales on the order of carrier mean free paths, thermal transport is no longer dictated by the thermal properties of the materials comprising the devices, but rather the transport of energy across the interfaces between adjacent materials in the devices. In this paper, current theories and experiments concerning phonon scattering processes driving thermal boundary conductance (hBD) are reviewed. Experimental studies of thermal boundary conductance conducted with the transient thermoreflectance technique challenging specific assumptions about phonon scattering during thermal boundary conductance are presented. To examine the effects of atomic mixing at the interface on hBD, a series of Cr/Si samples was fabricated subject to different deposition conditions. The varying degrees of atomic mixing were measured with Auger electron spectroscopy. Phonon scattering phenomena in the presence of interfacial mixing were observed with the trends in the Cr/Si hBD. The experimental results are reviewed and a virtual crystal diffuse mismatch model is presented to add insight into the effect of interatomic mixing at the interface. The assumption that phonons can only transmit energy across the interface by scattering with a phonon of the same frequency—i.e., elastic scattering, can lead to underpredictions of hBD by almost an order of magnitude. To examine the effects of inelastic scattering on hBD, a series of metal/dielectric interfaces with a wide range of vibrational similarity is studied at temperatures above and around materials’ Debye temperatures. Inelastic scattering is observed and new models are developed to predict hBD and its relative dependency on elastic and inelastic scattering events.
    keyword(s): Phonons , Radiation scattering , Electromagnetic scattering , Electrical conductance , Temperature , Thermoreflectance , Elastic scattering AND Measurement ,
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      Examining Interfacial Diffuse Phonon Scattering Through Transient Thermoreflectance Measurements of Thermal Boundary Conductance

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    http://yetl.yabesh.ir/yetl1/handle/yetl/141093
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    contributor authorPamela M. Norris
    contributor authorPatrick E. Hopkins
    date accessioned2017-05-09T00:33:53Z
    date available2017-05-09T00:33:53Z
    date copyrightApril, 2009
    date issued2009
    identifier issn0022-1481
    identifier otherJHTRAO-27859#043207_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/141093
    description abstractToday’s electronic and optoelectronic devices are plagued by heat transfer issues. As device dimensions shrink and operating frequencies increase, ever-increasing amounts of thermal energy are being generated in smaller and smaller volumes. As devices shrink to length scales on the order of carrier mean free paths, thermal transport is no longer dictated by the thermal properties of the materials comprising the devices, but rather the transport of energy across the interfaces between adjacent materials in the devices. In this paper, current theories and experiments concerning phonon scattering processes driving thermal boundary conductance (hBD) are reviewed. Experimental studies of thermal boundary conductance conducted with the transient thermoreflectance technique challenging specific assumptions about phonon scattering during thermal boundary conductance are presented. To examine the effects of atomic mixing at the interface on hBD, a series of Cr/Si samples was fabricated subject to different deposition conditions. The varying degrees of atomic mixing were measured with Auger electron spectroscopy. Phonon scattering phenomena in the presence of interfacial mixing were observed with the trends in the Cr/Si hBD. The experimental results are reviewed and a virtual crystal diffuse mismatch model is presented to add insight into the effect of interatomic mixing at the interface. The assumption that phonons can only transmit energy across the interface by scattering with a phonon of the same frequency—i.e., elastic scattering, can lead to underpredictions of hBD by almost an order of magnitude. To examine the effects of inelastic scattering on hBD, a series of metal/dielectric interfaces with a wide range of vibrational similarity is studied at temperatures above and around materials’ Debye temperatures. Inelastic scattering is observed and new models are developed to predict hBD and its relative dependency on elastic and inelastic scattering events.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleExamining Interfacial Diffuse Phonon Scattering Through Transient Thermoreflectance Measurements of Thermal Boundary Conductance
    typeJournal Paper
    journal volume131
    journal issue4
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.3072928
    journal fristpage43207
    identifier eissn1528-8943
    keywordsPhonons
    keywordsRadiation scattering
    keywordsElectromagnetic scattering
    keywordsElectrical conductance
    keywordsTemperature
    keywordsThermoreflectance
    keywordsElastic scattering AND Measurement
    treeJournal of Heat Transfer:;2009:;volume( 131 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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