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    Inelastic Contact Behavior of Crystalline Asperities in rf MEMS Devices

    Source: Journal of Engineering Materials and Technology:;2009:;volume( 131 ):;issue: 001::page 11002
    Author:
    O. Rezvanian
    ,
    M. A. Zikry
    DOI: 10.1115/1.3026545
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Microelectromechanical systems (MEMS), particularly those with radio frequency (rf) applications, have demonstrated significantly better performance over current electromechanical and solid-state technologies. Surface roughness and asperity microcontacts are critical factors that can affect contact behavior at scales ranging from the nano to the micro in MEMS devices. Recent investigations at the continuum level have underscored the importance of microstructural effects on the inelastic behavior of asperity microcontacts. Hence, a microstructurally based approach that accounts for the inhomogeneous deformation of the asperity microcontacts under cyclic loading and that is directly related to asperity physical scales and anisotropies can provide a detailed understanding of the deformation mechanisms associated with asperity microcontacts so that guidelines can be incorporated in the design and fabrication process to effectively size critical components and forces for significantly improved device durability and performance. A physically based microstructural representation of fcc crystalline materials that couples a multiple-slip crystal plasticity formulation to dislocation densities is used in a specialized finite-element modeling framework. The asperity model and the loading conditions are based on realistic service conditions consistent with rf MEMS with metallic normal contacts. The evolving microstructure, stress fields, contact width, hardness, residual effects, and the localized phenomena that can contribute to failure initiation and evolution in the flattening of single crystal gold asperity microcontacts are characterized for a loading-unloading cycle. It is shown that the nonuniform loading conditions due to asperity geometry and contact loading and the size effects due to asperity dimensions result in significant contribution of the geometrically necessary dislocation densities to stress, deformation, and microstructural evolution of crystalline asperities. This is not captured in modeling efforts based on von Mises continuum plasticity formulations. Residual strains and stresses are shown to develop during the cyclic loading. Localized tensile stress regions are shown to develop due to stress reversal and strain hardening during both loading and unloading regimes. Hardness predictions also indicate that nano-indentation hardness values of the contact material can overestimate the contact force in cases, where a rigid flat surface is pressed on a surface roughness asperity.
    keyword(s): Plasticity , Deformation , Crystals , Dimensions , Density , Force , Stress , Microelectromechanical systems , Finite element analysis , Cycles , Dislocations , Geometry , Mechanisms , Surface roughness , Failure , Work hardening , Thin films , Gradients , Tension , Nanoindentation , Modeling AND Design ,
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      Inelastic Contact Behavior of Crystalline Asperities in rf MEMS Devices

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    http://yetl.yabesh.ir/yetl1/handle/yetl/140621
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    • Journal of Engineering Materials and Technology

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    contributor authorO. Rezvanian
    contributor authorM. A. Zikry
    date accessioned2017-05-09T00:32:58Z
    date available2017-05-09T00:32:58Z
    date copyrightJanuary, 2009
    date issued2009
    identifier issn0094-4289
    identifier otherJEMTA8-27113#011002_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/140621
    description abstractMicroelectromechanical systems (MEMS), particularly those with radio frequency (rf) applications, have demonstrated significantly better performance over current electromechanical and solid-state technologies. Surface roughness and asperity microcontacts are critical factors that can affect contact behavior at scales ranging from the nano to the micro in MEMS devices. Recent investigations at the continuum level have underscored the importance of microstructural effects on the inelastic behavior of asperity microcontacts. Hence, a microstructurally based approach that accounts for the inhomogeneous deformation of the asperity microcontacts under cyclic loading and that is directly related to asperity physical scales and anisotropies can provide a detailed understanding of the deformation mechanisms associated with asperity microcontacts so that guidelines can be incorporated in the design and fabrication process to effectively size critical components and forces for significantly improved device durability and performance. A physically based microstructural representation of fcc crystalline materials that couples a multiple-slip crystal plasticity formulation to dislocation densities is used in a specialized finite-element modeling framework. The asperity model and the loading conditions are based on realistic service conditions consistent with rf MEMS with metallic normal contacts. The evolving microstructure, stress fields, contact width, hardness, residual effects, and the localized phenomena that can contribute to failure initiation and evolution in the flattening of single crystal gold asperity microcontacts are characterized for a loading-unloading cycle. It is shown that the nonuniform loading conditions due to asperity geometry and contact loading and the size effects due to asperity dimensions result in significant contribution of the geometrically necessary dislocation densities to stress, deformation, and microstructural evolution of crystalline asperities. This is not captured in modeling efforts based on von Mises continuum plasticity formulations. Residual strains and stresses are shown to develop during the cyclic loading. Localized tensile stress regions are shown to develop due to stress reversal and strain hardening during both loading and unloading regimes. Hardness predictions also indicate that nano-indentation hardness values of the contact material can overestimate the contact force in cases, where a rigid flat surface is pressed on a surface roughness asperity.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleInelastic Contact Behavior of Crystalline Asperities in rf MEMS Devices
    typeJournal Paper
    journal volume131
    journal issue1
    journal titleJournal of Engineering Materials and Technology
    identifier doi10.1115/1.3026545
    journal fristpage11002
    identifier eissn1528-8889
    keywordsPlasticity
    keywordsDeformation
    keywordsCrystals
    keywordsDimensions
    keywordsDensity
    keywordsForce
    keywordsStress
    keywordsMicroelectromechanical systems
    keywordsFinite element analysis
    keywordsCycles
    keywordsDislocations
    keywordsGeometry
    keywordsMechanisms
    keywordsSurface roughness
    keywordsFailure
    keywordsWork hardening
    keywordsThin films
    keywordsGradients
    keywordsTension
    keywordsNanoindentation
    keywordsModeling AND Design
    treeJournal of Engineering Materials and Technology:;2009:;volume( 131 ):;issue: 001
    contenttypeFulltext
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