A Submicron Multiaxis Positioning Stage for Micro- and Nanoscale Manufacturing Processes

Abstract

A piezoelectrically driven, submicron XY-positioning stage with multiprocess capability is developed and then integrated into two micro∕nanoscale manufacturing processes to improve their performance. The design is based on the HexFlex™ mechanism but is modified to improve structural robustness using a combination of factorial design, linear programming, and finite element analysis. Performance analysis reveals travel ranges of 16μm (X-axis) and 8μm (Y-axis), positioning accuracies of 87nm (X-axis) and 92nm (Y-axis), and overall stiffnesses of 32N∕μm (X-axis) and 36N∕μm (Y-axis). A comparison of microfluidic channels manufactured with a micromachine tool (mMT) alone and with the stage stacked on the mMT shows an improvement in feature accuracy from 870nmto170nm. The stage is integrated with an electrochemical deposition setup. Nanowire structures with sharp angles are fabricated. The diameter of these nanowires shows an improvement in uniformity by decreasing the standard deviation of diameter variation from 2.088μmto0.009μm.