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    Thermocouple Fixation Method for Grinding Temperature Measurement

    Source: Journal of Manufacturing Science and Engineering:;2008:;volume( 130 ):;issue: 005::page 51014
    Author:
    Bin Shen
    ,
    Guoxian Xiao
    ,
    Changsheng Guo
    ,
    Stephen Malkin
    ,
    Albert J. Shih
    DOI: 10.1115/1.2976142
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A new thermocouple fixation method for grinding temperature measurement is presented. Unlike the conventional method using a welded thermocouple, this new method uses epoxy for affixing the embedded thermocouple within a blind hole in the workpiece subsurface. During grinding, the thermocouple junction is exposed and bonded to provide direct contact with the ground surface by the smearing of the workpiece material. Experiments were conducted to evaluate this simplified thermocouple fixation method including the effect of thermocouple junction size. Heat transfer models were applied to calculate the energy partition for grinding under dry, wet, and minimum quantity lubrication (MQL) conditions. For shallow-cut grinding of cast iron using a vitreous bond aluminum oxide wheel, the energy partition using a small wheel depth of cut of 10 μm was estimated as 84% for dry grinding, 84% for MQL grinding, but only 24% for wet grinding. Such a small energy partition with wet grinding can be attributed to cooling by the fluid at the grinding zone. Increasing the wheel depth of cut to 25 μm for wet grinding resulted in a much bigger energy partition of 92%, which can be attributed to fluid film boiling and loss of cooling at the grinding zone.
    keyword(s): Temperature measurement , Grinding , Interior walls , Temperature , Thermocouples , Heat transfer AND Junctions ,
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      Thermocouple Fixation Method for Grinding Temperature Measurement

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    http://yetl.yabesh.ir/yetl1/handle/yetl/138672
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    contributor authorBin Shen
    contributor authorGuoxian Xiao
    contributor authorChangsheng Guo
    contributor authorStephen Malkin
    contributor authorAlbert J. Shih
    date accessioned2017-05-09T00:29:20Z
    date available2017-05-09T00:29:20Z
    date copyrightOctober, 2008
    date issued2008
    identifier issn1087-1357
    identifier otherJMSEFK-28030#051014_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/138672
    description abstractA new thermocouple fixation method for grinding temperature measurement is presented. Unlike the conventional method using a welded thermocouple, this new method uses epoxy for affixing the embedded thermocouple within a blind hole in the workpiece subsurface. During grinding, the thermocouple junction is exposed and bonded to provide direct contact with the ground surface by the smearing of the workpiece material. Experiments were conducted to evaluate this simplified thermocouple fixation method including the effect of thermocouple junction size. Heat transfer models were applied to calculate the energy partition for grinding under dry, wet, and minimum quantity lubrication (MQL) conditions. For shallow-cut grinding of cast iron using a vitreous bond aluminum oxide wheel, the energy partition using a small wheel depth of cut of 10 μm was estimated as 84% for dry grinding, 84% for MQL grinding, but only 24% for wet grinding. Such a small energy partition with wet grinding can be attributed to cooling by the fluid at the grinding zone. Increasing the wheel depth of cut to 25 μm for wet grinding resulted in a much bigger energy partition of 92%, which can be attributed to fluid film boiling and loss of cooling at the grinding zone.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermocouple Fixation Method for Grinding Temperature Measurement
    typeJournal Paper
    journal volume130
    journal issue5
    journal titleJournal of Manufacturing Science and Engineering
    identifier doi10.1115/1.2976142
    journal fristpage51014
    identifier eissn1528-8935
    keywordsTemperature measurement
    keywordsGrinding
    keywordsInterior walls
    keywordsTemperature
    keywordsThermocouples
    keywordsHeat transfer AND Junctions
    treeJournal of Manufacturing Science and Engineering:;2008:;volume( 130 ):;issue: 005
    contenttypeFulltext
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