Impact of Interface Resistance on Pulsed Thermoelectric CoolingSource: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 001::page 14502Author:Y. Sungtaek Ju
DOI: 10.1115/1.2780186Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Pulsed thermoelectric cooling is an attractive approach for the site specific thermal management of infrared sensors and other low-heat flux devices. Intense Joule heating caused by electrical interface resistance, however, can severely degrade pulsed cooling performance. Numerical simulations are used to quantify the impact of the interface resistance on pulsed thermoelectric cooling. The degradation in performance is most pronounced for microcoolers that have small bulk resistivity at high pulse amplitudes. Our work also forms a basis for new techniques to probe interfaces in TE devices for energy harvesting as well as cooling applications.
keyword(s): Temperature , Cooling , Electrical resistance , Thermoelectric cooling , Junctions , Computer simulation , Heating , Joules AND Steady state ,
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| contributor author | Y. Sungtaek Ju | |
| date accessioned | 2017-05-09T00:29:16Z | |
| date available | 2017-05-09T00:29:16Z | |
| date copyright | January, 2008 | |
| date issued | 2008 | |
| identifier issn | 0022-1481 | |
| identifier other | JHTRAO-27830#014502_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/138633 | |
| description abstract | Pulsed thermoelectric cooling is an attractive approach for the site specific thermal management of infrared sensors and other low-heat flux devices. Intense Joule heating caused by electrical interface resistance, however, can severely degrade pulsed cooling performance. Numerical simulations are used to quantify the impact of the interface resistance on pulsed thermoelectric cooling. The degradation in performance is most pronounced for microcoolers that have small bulk resistivity at high pulse amplitudes. Our work also forms a basis for new techniques to probe interfaces in TE devices for energy harvesting as well as cooling applications. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Impact of Interface Resistance on Pulsed Thermoelectric Cooling | |
| type | Journal Paper | |
| journal volume | 130 | |
| journal issue | 1 | |
| journal title | Journal of Heat Transfer | |
| identifier doi | 10.1115/1.2780186 | |
| journal fristpage | 14502 | |
| identifier eissn | 1528-8943 | |
| keywords | Temperature | |
| keywords | Cooling | |
| keywords | Electrical resistance | |
| keywords | Thermoelectric cooling | |
| keywords | Junctions | |
| keywords | Computer simulation | |
| keywords | Heating | |
| keywords | Joules AND Steady state | |
| tree | Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 001 | |
| contenttype | Fulltext |