YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Heat Transfer
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Heat Transfer
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Analytical Solution for Heat Conduction Near an Encapsulated Sphere With Heat Generation

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 002::page 24502
    Author:
    Douglas L. Oliver
    DOI: 10.1115/1.2789717
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The analytic study of heat conduction near spheres is a relatively mature science. Even so, there are still a number of analytic conduction solutions being published. For example, Atefi and Moghimi (1) recently presented a Fourier series solution for heat transfer near a hollow sphere.
    keyword(s): Heat , Heat conduction , Temperature profiles , Temperature AND Equations ,
    • Download: (198.7Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Analytical Solution for Heat Conduction Near an Encapsulated Sphere With Heat Generation

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/138617
    Collections
    • Journal of Heat Transfer

    Show full item record

    contributor authorDouglas L. Oliver
    date accessioned2017-05-09T00:29:14Z
    date available2017-05-09T00:29:14Z
    date copyrightFebruary, 2008
    date issued2008
    identifier issn0022-1481
    identifier otherJHTRAO-27831#024502_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/138617
    description abstractThe analytic study of heat conduction near spheres is a relatively mature science. Even so, there are still a number of analytic conduction solutions being published. For example, Atefi and Moghimi (1) recently presented a Fourier series solution for heat transfer near a hollow sphere.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAnalytical Solution for Heat Conduction Near an Encapsulated Sphere With Heat Generation
    typeJournal Paper
    journal volume130
    journal issue2
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.2789717
    journal fristpage24502
    identifier eissn1528-8943
    keywordsHeat
    keywordsHeat conduction
    keywordsTemperature profiles
    keywordsTemperature AND Equations
    treeJournal of Heat Transfer:;2008:;volume( 130 ):;issue: 002
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian