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    Studies on Optimum Distribution of Fins in Heat Sinks Filled With Phase Change Materials

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 003::page 34505
    Author:
    S. K. Saha
    ,
    K. Srinivasan
    ,
    P. Dutta
    DOI: 10.1115/1.2804948
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enhancer (TCE), as a means of thermal management of electronic systems. Eicosane is used as PCM, while aluminium pin or plate fins are used as TCE. The test section considered in all cases is a 42×42mm2 base with a TCE height of 25mm. An electrical heater at the heat sink base is used to simulate the heat generation in electronic chips. Various volumetric fractions of TCE in the conglomerate of PCM and TCE are considered. The case with 8% TCE volume fraction was found to have the best thermal performance. With this volume fraction of TCE, the effects of fin dimension and fin shape are also investigated. It is found that a large number of small cross-sectional area fins is preferable. A numerical model is also developed to enable an interpretation of experimental results.
    keyword(s): Heat , Temperature , Phase change materials , Fins , Heat sinks , Dimensions , Aluminum , Thermal management AND Thermal conductivity ,
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      Studies on Optimum Distribution of Fins in Heat Sinks Filled With Phase Change Materials

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/138601
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    contributor authorS. K. Saha
    contributor authorK. Srinivasan
    contributor authorP. Dutta
    date accessioned2017-05-09T00:29:12Z
    date available2017-05-09T00:29:12Z
    date copyrightMarch, 2008
    date issued2008
    identifier issn0022-1481
    identifier otherJHTRAO-27833#034505_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/138601
    description abstractThis paper deals with phase change material (PCM), used in conjunction with thermal conductivity enhancer (TCE), as a means of thermal management of electronic systems. Eicosane is used as PCM, while aluminium pin or plate fins are used as TCE. The test section considered in all cases is a 42×42mm2 base with a TCE height of 25mm. An electrical heater at the heat sink base is used to simulate the heat generation in electronic chips. Various volumetric fractions of TCE in the conglomerate of PCM and TCE are considered. The case with 8% TCE volume fraction was found to have the best thermal performance. With this volume fraction of TCE, the effects of fin dimension and fin shape are also investigated. It is found that a large number of small cross-sectional area fins is preferable. A numerical model is also developed to enable an interpretation of experimental results.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleStudies on Optimum Distribution of Fins in Heat Sinks Filled With Phase Change Materials
    typeJournal Paper
    journal volume130
    journal issue3
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.2804948
    journal fristpage34505
    identifier eissn1528-8943
    keywordsHeat
    keywordsTemperature
    keywordsPhase change materials
    keywordsFins
    keywordsHeat sinks
    keywordsDimensions
    keywordsAluminum
    keywordsThermal management AND Thermal conductivity
    treeJournal of Heat Transfer:;2008:;volume( 130 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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