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    Heat Transport Characteristics in a Miniature Flat Heat Pipe With Wire Core Wicks

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 005::page 51501
    Author:
    A. J. Jiao
    ,
    H. B. Ma
    ,
    J. K. Critser
    DOI: 10.1115/1.2887858
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A mathematical model predicting the heat transport capability in a miniature flat heat pipe (FHP) with a wired wick structure was developed to analytically determine its maximum heat transport rate including the capillary limit. The effects of gravity on the profile of the thin-film-evaporation region and the distribution of the heat flux along a curved surface were investigated. The heat transfer characteristics of the thin-film evaporation on the curved surface were also analyzed and compared with that on a flat surface. Combining the analysis on the thin-film-condensation heat transfer in the condenser, the model can be used to predict the total temperature drop between the evaporator and condenser in the FHP. In order to verify the model, an experimental investigation was conducted. The theoretical results predicted by the model agree well with the experimental data for the heat transfer process occurring in the FHP with the wired wick structure. Results of the investigation will assist in the optimum design of the curved-surface wicks to enlarge the thin-film-evaporation region and a better understanding of heat transfer mechanisms in heat pipes.
    keyword(s): Thin films , Heat , Evaporation , Heat pipes , Condensers (steam plant) , Heat transfer , Wire , Flat heat pipes , Temperature , Heat flux , Stress , Flow (Dynamics) AND Condensation ,
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      Heat Transport Characteristics in a Miniature Flat Heat Pipe With Wire Core Wicks

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    http://yetl.yabesh.ir/yetl1/handle/yetl/138553
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    contributor authorA. J. Jiao
    contributor authorH. B. Ma
    contributor authorJ. K. Critser
    date accessioned2017-05-09T00:29:05Z
    date available2017-05-09T00:29:05Z
    date copyrightMay, 2008
    date issued2008
    identifier issn0022-1481
    identifier otherJHTRAO-27836#051501_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/138553
    description abstractA mathematical model predicting the heat transport capability in a miniature flat heat pipe (FHP) with a wired wick structure was developed to analytically determine its maximum heat transport rate including the capillary limit. The effects of gravity on the profile of the thin-film-evaporation region and the distribution of the heat flux along a curved surface were investigated. The heat transfer characteristics of the thin-film evaporation on the curved surface were also analyzed and compared with that on a flat surface. Combining the analysis on the thin-film-condensation heat transfer in the condenser, the model can be used to predict the total temperature drop between the evaporator and condenser in the FHP. In order to verify the model, an experimental investigation was conducted. The theoretical results predicted by the model agree well with the experimental data for the heat transfer process occurring in the FHP with the wired wick structure. Results of the investigation will assist in the optimum design of the curved-surface wicks to enlarge the thin-film-evaporation region and a better understanding of heat transfer mechanisms in heat pipes.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleHeat Transport Characteristics in a Miniature Flat Heat Pipe With Wire Core Wicks
    typeJournal Paper
    journal volume130
    journal issue5
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.2887858
    journal fristpage51501
    identifier eissn1528-8943
    keywordsThin films
    keywordsHeat
    keywordsEvaporation
    keywordsHeat pipes
    keywordsCondensers (steam plant)
    keywordsHeat transfer
    keywordsWire
    keywordsFlat heat pipes
    keywordsTemperature
    keywordsHeat flux
    keywordsStress
    keywordsFlow (Dynamics) AND Condensation
    treeJournal of Heat Transfer:;2008:;volume( 130 ):;issue: 005
    contenttypeFulltext
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