On the CMP Material Removal at the Molecular ScaleSource: Journal of Tribology:;2007:;volume( 129 ):;issue: 002::page 436Author:L. Chang
DOI: 10.1115/1.2647829Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Understanding of the mechanisms of material removal is of fundamental importance in chemical-mechanical planarization of semiconductor wafers. A plausible mechanism at work is that the material is removed at the molecular scale by debonding the chemistry-weakened molecules at the wafer surface. A sequence of order-of-magnitude calculations is carried out to substantiate this mechanism of chemical-mechanical polishing (CMP) materials removal. The analysis may lend further credence to the mechanism in addition to its underlying theoretical foundation.
keyword(s): Particulate matter , Semiconductor wafers , Polishing , Chemistry , Mechanisms AND Slurries ,
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| contributor author | L. Chang | |
| date accessioned | 2017-05-09T00:25:55Z | |
| date available | 2017-05-09T00:25:55Z | |
| date copyright | April, 2007 | |
| date issued | 2007 | |
| identifier issn | 0742-4787 | |
| identifier other | JOTRE9-28749#436_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/136918 | |
| description abstract | Understanding of the mechanisms of material removal is of fundamental importance in chemical-mechanical planarization of semiconductor wafers. A plausible mechanism at work is that the material is removed at the molecular scale by debonding the chemistry-weakened molecules at the wafer surface. A sequence of order-of-magnitude calculations is carried out to substantiate this mechanism of chemical-mechanical polishing (CMP) materials removal. The analysis may lend further credence to the mechanism in addition to its underlying theoretical foundation. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | On the CMP Material Removal at the Molecular Scale | |
| type | Journal Paper | |
| journal volume | 129 | |
| journal issue | 2 | |
| journal title | Journal of Tribology | |
| identifier doi | 10.1115/1.2647829 | |
| journal fristpage | 436 | |
| journal lastpage | 437 | |
| identifier eissn | 1528-8897 | |
| keywords | Particulate matter | |
| keywords | Semiconductor wafers | |
| keywords | Polishing | |
| keywords | Chemistry | |
| keywords | Mechanisms AND Slurries | |
| tree | Journal of Tribology:;2007:;volume( 129 ):;issue: 002 | |
| contenttype | Fulltext |