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    Effect of Rising and Falling K Profiles on SCC Growth Rates in High-Temperature Water

    Source: Journal of Pressure Vessel Technology:;2007:;volume( 129 ):;issue: 003::page 488
    Author:
    Peter L. Andresen
    ,
    Martin M. Morra
    DOI: 10.1115/1.2748830
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Effects of rising and falling stress intensity factor (K) profiles on the stress corrosion cracking (SCC) growth rates of stainless steel and nickel alloys has been studied in high-temperature water. Sophisticated test control software was used that changes loading (P) based on crack length (a) to achieve a specific K trajectory by controlling dK∕da, not simply dP∕dt. The majority of SCC problems develop adjacent to welds, which have a complex residual stress profile versus wall thickness. This, coupled with the dependence of K on crack length, causes K to change as the crack grows, not per se with time (t). The effect of the rate of change in K on crack tip strain rate and the associated crack growth rate is discussed, along with the repercussions to understanding and dispositioning SCC response.
    keyword(s): Temperature , Fracture (Materials) , Water , Stress , Stainless steel , Stress AND Corrosion ,
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      Effect of Rising and Falling K Profiles on SCC Growth Rates in High-Temperature Water

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    http://yetl.yabesh.ir/yetl1/handle/yetl/136698
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    contributor authorPeter L. Andresen
    contributor authorMartin M. Morra
    date accessioned2017-05-09T00:25:31Z
    date available2017-05-09T00:25:31Z
    date copyrightAugust, 2007
    date issued2007
    identifier issn0094-9930
    identifier otherJPVTAS-28483#488_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/136698
    description abstractEffects of rising and falling stress intensity factor (K) profiles on the stress corrosion cracking (SCC) growth rates of stainless steel and nickel alloys has been studied in high-temperature water. Sophisticated test control software was used that changes loading (P) based on crack length (a) to achieve a specific K trajectory by controlling dK∕da, not simply dP∕dt. The majority of SCC problems develop adjacent to welds, which have a complex residual stress profile versus wall thickness. This, coupled with the dependence of K on crack length, causes K to change as the crack grows, not per se with time (t). The effect of the rate of change in K on crack tip strain rate and the associated crack growth rate is discussed, along with the repercussions to understanding and dispositioning SCC response.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEffect of Rising and Falling K Profiles on SCC Growth Rates in High-Temperature Water
    typeJournal Paper
    journal volume129
    journal issue3
    journal titleJournal of Pressure Vessel Technology
    identifier doi10.1115/1.2748830
    journal fristpage488
    journal lastpage506
    identifier eissn1528-8978
    keywordsTemperature
    keywordsFracture (Materials)
    keywordsWater
    keywordsStress
    keywordsStainless steel
    keywordsStress AND Corrosion
    treeJournal of Pressure Vessel Technology:;2007:;volume( 129 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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