Creep-Fatigue Life Evaluation for Sn-3.5Ag SolderSource: Journal of Engineering Materials and Technology:;2006:;volume( 128 ):;issue: 002::page 142DOI: 10.1115/1.2172273Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper studies the creep-fatigue life evaluation of Sn-3.5Ag solder under push-pull loading using fast-fast, fast-slow, slow-fast, slow-slow, and strain-hold strain waves. Extensive creep-fatigue data were generated using these strain waves and the applicability of four conventional creep-fatigue damage rules, the linear damage rule, the frequency modified fatigue life, the ductility exhaustion model, and the strain range partitioning method, was examined. No conventional damage rules evaluated creep-fatigue lives accurately. Only the grain boundary sliding model, developed recently for solders, predicted creep-fatigue lives with a small scatter.
keyword(s): Creep , Fatigue , Solders , Waves AND Grain boundaries ,
|
Collections
Show full item record
| contributor author | Mineo Nozaki | |
| contributor author | Masao Sakane | |
| contributor author | Yutaka Tsukada | |
| contributor author | Hideo Nishimura | |
| date accessioned | 2017-05-09T00:20:03Z | |
| date available | 2017-05-09T00:20:03Z | |
| date copyright | April, 2006 | |
| date issued | 2006 | |
| identifier issn | 0094-4289 | |
| identifier other | JEMTA8-27082#142_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/133795 | |
| description abstract | This paper studies the creep-fatigue life evaluation of Sn-3.5Ag solder under push-pull loading using fast-fast, fast-slow, slow-fast, slow-slow, and strain-hold strain waves. Extensive creep-fatigue data were generated using these strain waves and the applicability of four conventional creep-fatigue damage rules, the linear damage rule, the frequency modified fatigue life, the ductility exhaustion model, and the strain range partitioning method, was examined. No conventional damage rules evaluated creep-fatigue lives accurately. Only the grain boundary sliding model, developed recently for solders, predicted creep-fatigue lives with a small scatter. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Creep-Fatigue Life Evaluation for Sn-3.5Ag Solder | |
| type | Journal Paper | |
| journal volume | 128 | |
| journal issue | 2 | |
| journal title | Journal of Engineering Materials and Technology | |
| identifier doi | 10.1115/1.2172273 | |
| journal fristpage | 142 | |
| journal lastpage | 150 | |
| identifier eissn | 1528-8889 | |
| keywords | Creep | |
| keywords | Fatigue | |
| keywords | Solders | |
| keywords | Waves AND Grain boundaries | |
| tree | Journal of Engineering Materials and Technology:;2006:;volume( 128 ):;issue: 002 | |
| contenttype | Fulltext |