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    An Investigation of the Effects of Microstructure on Fatigue Crack Growth in Ti-6242

    Source: Journal of Engineering Materials and Technology:;2005:;volume( 127 ):;issue: 001::page 46
    Author:
    F. McBagonluri
    ,
    E. Akpan
    ,
    C. Mercer
    ,
    W. Shen
    ,
    W. O. Soboyejo
    DOI: 10.1115/1.1836771
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Surface and subsurface crack nucleation and growth mechanisms are elucidated for equiaxed (microstructure 1), elongated (microstructure 2), and colony (microstructure 3) microstructures of Ti6242. Prominent cleavage facets, indicative of a Stroh-type dislocation-pile phenomenon characterize the nucleation sites. Beachmarking and scanning electron microscopy (SEM) techniques are used to study fatigue crack growth rates and crack shape evolution in the short and long crack regimes. The studies reveal that surface crack growth rate data are generally comparable to the through-crack growth rate data in the long crack growth regime. However, the depth crack growth rates are somewhat slower than the through-crack growth rates. Surface crack evolution profiles are shown to exhibit a tendency towards “Preferred Propagation Paths” (PPPs). However, the magnitudes of the aspect ratios along the PPPs are different from those reported for square or rectangular cross sections subjected to cyclic tension or bending loads. Finally, the measured crack lengths and aspect ratios are compared with predictions obtained from a fracture mechanics model.
    keyword(s): Nucleation (Physics) , Fracture (Materials) , Fatigue cracks , Fracture mechanics , Shapes , Stress , Fatigue AND Mechanisms ,
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      An Investigation of the Effects of Microstructure on Fatigue Crack Growth in Ti-6242

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    http://yetl.yabesh.ir/yetl1/handle/yetl/131909
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    contributor authorF. McBagonluri
    contributor authorE. Akpan
    contributor authorC. Mercer
    contributor authorW. Shen
    contributor authorW. O. Soboyejo
    date accessioned2017-05-09T00:16:20Z
    date available2017-05-09T00:16:20Z
    date copyrightJanuary, 2005
    date issued2005
    identifier issn0094-4289
    identifier otherJEMTA8-27065#46_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131909
    description abstractSurface and subsurface crack nucleation and growth mechanisms are elucidated for equiaxed (microstructure 1), elongated (microstructure 2), and colony (microstructure 3) microstructures of Ti6242. Prominent cleavage facets, indicative of a Stroh-type dislocation-pile phenomenon characterize the nucleation sites. Beachmarking and scanning electron microscopy (SEM) techniques are used to study fatigue crack growth rates and crack shape evolution in the short and long crack regimes. The studies reveal that surface crack growth rate data are generally comparable to the through-crack growth rate data in the long crack growth regime. However, the depth crack growth rates are somewhat slower than the through-crack growth rates. Surface crack evolution profiles are shown to exhibit a tendency towards “Preferred Propagation Paths” (PPPs). However, the magnitudes of the aspect ratios along the PPPs are different from those reported for square or rectangular cross sections subjected to cyclic tension or bending loads. Finally, the measured crack lengths and aspect ratios are compared with predictions obtained from a fracture mechanics model.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAn Investigation of the Effects of Microstructure on Fatigue Crack Growth in Ti-6242
    typeJournal Paper
    journal volume127
    journal issue1
    journal titleJournal of Engineering Materials and Technology
    identifier doi10.1115/1.1836771
    journal fristpage46
    journal lastpage57
    identifier eissn1528-8889
    keywordsNucleation (Physics)
    keywordsFracture (Materials)
    keywordsFatigue cracks
    keywordsFracture mechanics
    keywordsShapes
    keywordsStress
    keywordsFatigue AND Mechanisms
    treeJournal of Engineering Materials and Technology:;2005:;volume( 127 ):;issue: 001
    contenttypeFulltext
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