contributor author | Brad L. Kinsey | |
contributor author | Jian Cao | |
date accessioned | 2017-05-09T00:10:46Z | |
date available | 2017-05-09T00:10:46Z | |
date copyright | May, 2003 | |
date issued | 2003 | |
identifier issn | 1087-1357 | |
identifier other | JMSEFK-27682#344_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128735 | |
description abstract | Tailor Welded Blanks (TWBs) offer several notable benefits including decreased part weight, reduced manufacturing costs, increased environmental friendliness, and improved dimensional consistency. In order to take advantage of these benefits, however, designers need to overcome the reduced formability of TWBs and be able to accurately predict unique characteristics related to TWB forming early in the design process. In this paper, an analytical model to predict the weld line movement and forming height for a uniform binder force, TWB forming application is presented. Comparison to numerical simulation results demonstrates the accuracy of this methodology. The analytical model provides designers a valuable tool to determine the location of steps on the die surface to accommodate the weld line movement and the potential forming height for a TWB forming with a uniform binder force. The methodology presented here has the potential to be extended to analyze a non-uniform binder force forming of TWBs. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | An Analytical Model for Tailor Welded Blank Forming | |
type | Journal Paper | |
journal volume | 125 | |
journal issue | 2 | |
journal title | Journal of Manufacturing Science and Engineering | |
identifier doi | 10.1115/1.1537261 | |
journal fristpage | 344 | |
journal lastpage | 351 | |
identifier eissn | 1528-8935 | |
keywords | Force | |
keywords | Binders (Materials) | |
keywords | Computer simulation | |
keywords | Blanks | |
keywords | Thickness | |
keywords | Plane strain | |
keywords | Geometry AND Equations | |
tree | Journal of Manufacturing Science and Engineering:;2003:;volume( 125 ):;issue: 002 | |
contenttype | Fulltext | |