Show simple item record

contributor authorX. Richard Zhang
contributor authorXianfan Xu
date accessioned2017-05-09T00:10:43Z
date available2017-05-09T00:10:43Z
date copyrightAugust, 2003
date issued2003
identifier issn1087-1357
identifier otherJMSEFK-27739#512_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128698
description abstractThis paper discusses high precision microscale laser bending and the thermomechanical phenomena involved. The use of a pulsed and a CW laser for microscale bending of ceramics, silicon, and stainless steel is demonstrated. For each laser, experiments are conducted to find out the relation between bending angles and laser operation parameters. Changes of the ceramics surface composition after laser irradiation are analyzed using an electron probe microanalyzer (EPMA). Results obtained by the pulsed and the CW laser are compared, and it is found that the CW laser produces more bending than the pulsed laser does. However, the pulsed laser causes much less surface composition change and thermomechanical damage to the targets. Numerical calculations based on the thermo-elasto-plastic theory are carried out and the results are used to explain the phenomena observed experimentally.
publisherThe American Society of Mechanical Engineers (ASME)
titleHigh Precision Microscale Bending by Pulsed and CW Lasers
typeJournal Paper
journal volume125
journal issue3
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.1580528
journal fristpage512
journal lastpage518
identifier eissn1528-8935
keywordsLasers
keywordsAccuracy
keywordsMicroscale devices AND Ceramics
treeJournal of Manufacturing Science and Engineering:;2003:;volume( 125 ):;issue: 003
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record