Special Issue on Solid Modeling Theory and Engineering Applications

Abstract

The ACM Symposium on Solid Modeling and Applications is an annual international forum for the exchange of recent research and applications of spatial modeling and computations in design, analysis and manufacturing, as well as in emerging biomedical, geophysical and other areas. Following what now has become an annual tradition, this Special Issue of JCISE includes a collection of papers that were presented at the Eighth ACM Symposium on Solid Modeling and Applications that was held at the University of Washington, Seattle, on June 16–20, 2003. The symposium was co-chaired by George Turkiyyah of University of Washington and Pere Brunet of Technical University of Catalonia in Barcelona, Spain. The international program committee included 26 leading industry and academia experts from 12 countries around the world and was co-chaired by Gershon Elber of Technion, Israel, and Vadim Shapiro of University of Wisconsin-Madison, USA. Close to eighty papers were received and reviewed for the conference by an international program committee and reviewers from around the world. At least three external reviewers and members of the program committee reviewed each paper. A total of 25 papers were selected for plenary presentation at the conference, 13 papers were selected for poster presentation, and 5 papers for shorter presentations in the new Emerging Concepts session.