contributor author | Martin Y. M. Chiang | |
contributor author | Chwan K. Chiang | |
contributor author | Wen-li Wu | |
date accessioned | 2017-05-09T00:07:37Z | |
date available | 2017-05-09T00:07:37Z | |
date copyright | April, 2002 | |
date issued | 2002 | |
identifier issn | 0094-4289 | |
identifier other | JEMTA8-27032#274_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126882 | |
description abstract | A technique for determining the in-plane modulus and the coefficient of thermal expansion (CTE) of supported thin films has been developed. The modulus and CTE are calculated by solving two coupled equations that relate the curvature of film samples deposited on two different substrates to the thermal and mechanical properties of the constituents. In contrast with the conventional method used to calculate modulus and CTE, which involves differentiation of the thermal stress in the film, this new technique does not require the differentiation of the thermal stress, and can also provide the temperature-dependence of the in-plane CTE and elastic modulus of supported thin films. The data reduction scheme used for deducing CTE and elastic modulus is direct and reliable. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A Technique for Deducing In-Plane Modulus and Coefficient of Thermal Expansion of a Supported Thin Film | |
type | Journal Paper | |
journal volume | 124 | |
journal issue | 2 | |
journal title | Journal of Engineering Materials and Technology | |
identifier doi | 10.1115/1.1448522 | |
journal fristpage | 274 | |
journal lastpage | 277 | |
identifier eissn | 1528-8889 | |
keywords | Thermal expansion | |
keywords | Thin films | |
keywords | Temperature | |
keywords | Elastic moduli | |
keywords | Equations | |
keywords | Thermal stresses AND Mechanical properties | |
tree | Journal of Engineering Materials and Technology:;2002:;volume( 124 ):;issue: 002 | |
contenttype | Fulltext | |