contributor author | Toru Ikeda | |
contributor author | Akira Yamashita | |
contributor author | Deokbo Lee | |
contributor author | Noriyuki Miyazaki | |
date accessioned | 2017-05-09T00:02:35Z | |
date available | 2017-05-09T00:02:35Z | |
date copyright | January, 2000 | |
date issued | 2000 | |
identifier issn | 0094-4289 | |
identifier other | JEMTA8-27003#80_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123798 | |
description abstract | The evaluation of a fracture from a thin layer constrained by a hard material is important in relation to the structural integrity of adhesive joints and composite materials. It has been reported that the fracture toughness of a crack in a ductile adhesive joint depends on the bond thickness, but the mechanism has not yet been elucidated clearly. In this study, the J-integral and the near-tip stress of a crack in an adhesive joint are investigated. It is determined that a decrease of the bond thickness increases the stress ahead of a crack rip, which results in the decrease of fracture toughness. [S0094-4289(00)01201-9] | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Failure of a Ductile Adhesive Layer Constrained by Hard Adherends | |
type | Journal Paper | |
journal volume | 122 | |
journal issue | 1 | |
journal title | Journal of Engineering Materials and Technology | |
identifier doi | 10.1115/1.482769 | |
journal fristpage | 80 | |
journal lastpage | 85 | |
identifier eissn | 1528-8889 | |
keywords | Adhesives | |
keywords | Stress | |
keywords | Adhesive joints | |
keywords | Fracture (Materials) | |
keywords | Failure | |
keywords | Fracture toughness | |
keywords | Thickness | |
keywords | Fracture (Process) AND Deformation | |
tree | Journal of Engineering Materials and Technology:;2000:;volume( 122 ):;issue: 001 | |
contenttype | Fulltext | |