contributor author | Ya Yun Li | |
contributor author | Jongwon Kim | |
contributor author | Yunquan Sun | |
contributor author | Yanhua Yang | |
date accessioned | 2017-05-09T00:00:13Z | |
date available | 2017-05-09T00:00:13Z | |
date copyright | August, 1999 | |
date issued | 1999 | |
identifier issn | 1087-1357 | |
identifier other | JMSEFK-27346#378_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/122469 | |
description abstract | A general three-dimensional thermal/stress grinding model, based on thermal and elastic/plastic classical analytical solutions, has been developed in this paper. The thermal model can predict the temperature distribution of surface and cylindrical external/internal creep-feed or conventional grinding for vertical or inclined sidewall surface grinding. This paper deals with a grinding burn problem that is widespread in the aerospace and automotive industries. The thermal model is compared with sidewall surface grinding experiments. The comparison of the temperature distribution results is expected. The general stress model has been developed, which combines both spherical and cylindrical coordinates. In addition, the 3D thermal/stress model is compared with four cases of external cylindrical grinding experiments. The residual stresses agree reasonably. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Thermomechanical Analytical 3D Thermal/Stress Estimation Sidewall Grinding Model | |
type | Journal Paper | |
journal volume | 121 | |
journal issue | 3 | |
journal title | Journal of Manufacturing Science and Engineering | |
identifier doi | 10.1115/1.2832692 | |
journal fristpage | 378 | |
journal lastpage | 384 | |
identifier eissn | 1528-8935 | |
keywords | Grinding | |
keywords | Thermal stresses | |
keywords | Temperature distribution | |
keywords | Aerospace industry | |
keywords | Stress | |
keywords | Creep AND Residual stresses | |
tree | Journal of Manufacturing Science and Engineering:;1999:;volume( 121 ):;issue: 003 | |
contenttype | Fulltext | |