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    Bimaterial Interfacial Crack Growth With Strain Gradient Theory

    Source: Journal of Engineering Materials and Technology:;1999:;volume( 121 ):;issue: 004::page 413
    Author:
    Su Hao
    ,
    Wing Kam Liu
    DOI: 10.1115/1.2812396
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The purpose of this paper is to investigate the effect of material heterogeneity on damage evolution and subsequent crack propagation in bimaterial systems. Strain gradient theory analysis reveals that a higher stress triaxiality always occurs on the softer material side due to the material mismatch in yield capacity and the corresponding strain gradient along the interface. High stress triaxiality is a major condition which promotes ductile damage and facilitates crack growth. To investigate this link, numerical simulations of ductile interface crack growth are performed using a damage based constitutive model. Both the numerical and experimental results show that a crack may grow along the interface or deviate into the softer material, but never turn into the harder material. The theoretical and numerical analysis reveal three factors which strongly affect the direction of crack growth and the resistance capacity of the bimaterial system against fracture. These are the boundary conditions which determine the global kinematically admissible displacement field, the stress/strain gradient near the interface due to the material mismatch, and the distance from the crack tip to the interface.
    keyword(s): Fracture (Materials) , Gradients , Stress , Computer simulation , Electrical resistance , Constitutive equations , Fracture (Process) , Numerical analysis , Boundary-value problems , Crack propagation AND Displacement ,
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      Bimaterial Interfacial Crack Growth With Strain Gradient Theory

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/122197
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    contributor authorSu Hao
    contributor authorWing Kam Liu
    date accessioned2017-05-08T23:59:44Z
    date available2017-05-08T23:59:44Z
    date copyrightOctober, 1999
    date issued1999
    identifier issn0094-4289
    identifier otherJEMTA8-27002#413_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/122197
    description abstractThe purpose of this paper is to investigate the effect of material heterogeneity on damage evolution and subsequent crack propagation in bimaterial systems. Strain gradient theory analysis reveals that a higher stress triaxiality always occurs on the softer material side due to the material mismatch in yield capacity and the corresponding strain gradient along the interface. High stress triaxiality is a major condition which promotes ductile damage and facilitates crack growth. To investigate this link, numerical simulations of ductile interface crack growth are performed using a damage based constitutive model. Both the numerical and experimental results show that a crack may grow along the interface or deviate into the softer material, but never turn into the harder material. The theoretical and numerical analysis reveal three factors which strongly affect the direction of crack growth and the resistance capacity of the bimaterial system against fracture. These are the boundary conditions which determine the global kinematically admissible displacement field, the stress/strain gradient near the interface due to the material mismatch, and the distance from the crack tip to the interface.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleBimaterial Interfacial Crack Growth With Strain Gradient Theory
    typeJournal Paper
    journal volume121
    journal issue4
    journal titleJournal of Engineering Materials and Technology
    identifier doi10.1115/1.2812396
    journal fristpage413
    journal lastpage421
    identifier eissn1528-8889
    keywordsFracture (Materials)
    keywordsGradients
    keywordsStress
    keywordsComputer simulation
    keywordsElectrical resistance
    keywordsConstitutive equations
    keywordsFracture (Process)
    keywordsNumerical analysis
    keywordsBoundary-value problems
    keywordsCrack propagation AND Displacement
    treeJournal of Engineering Materials and Technology:;1999:;volume( 121 ):;issue: 004
    contenttypeFulltext
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