Transient Thermal Stress and Associated Natural Frequency Variations in Circular Disk ElementsSource: Journal of Manufacturing Science and Engineering:;1967:;volume( 089 ):;issue: 002::page 265Author:C. D. Mote
DOI: 10.1115/1.3610038Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Most available thermal stress and associated natural frequency analyses of circular disk elements incorporate only the steady-state temperature distribution and intuitively assume that the transient is not significant. An analytical rule-of-thumb involving the calculation and test of a nondimensional number h1 is proposed for predicting conditions when the transient regime may be significantly more severe than the steady state. The number h1 = hb2 /ks a, a modified Biot number, involves disk surface heat transfer, disk conductivity, and geometry.
keyword(s): Thermal stresses , Disks , Steady state , Temperature distribution , Heat transfer , Conductivity AND Geometry ,
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contributor author | C. D. Mote | |
date accessioned | 2017-05-08T23:59:07Z | |
date available | 2017-05-08T23:59:07Z | |
date copyright | May, 1967 | |
date issued | 1967 | |
identifier issn | 1087-1357 | |
identifier other | JMSEFK-27510#265_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/121868 | |
description abstract | Most available thermal stress and associated natural frequency analyses of circular disk elements incorporate only the steady-state temperature distribution and intuitively assume that the transient is not significant. An analytical rule-of-thumb involving the calculation and test of a nondimensional number h1 is proposed for predicting conditions when the transient regime may be significantly more severe than the steady state. The number h1 = hb2 /ks a, a modified Biot number, involves disk surface heat transfer, disk conductivity, and geometry. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Transient Thermal Stress and Associated Natural Frequency Variations in Circular Disk Elements | |
type | Journal Paper | |
journal volume | 89 | |
journal issue | 2 | |
journal title | Journal of Manufacturing Science and Engineering | |
identifier doi | 10.1115/1.3610038 | |
journal fristpage | 265 | |
journal lastpage | 270 | |
identifier eissn | 1528-8935 | |
keywords | Thermal stresses | |
keywords | Disks | |
keywords | Steady state | |
keywords | Temperature distribution | |
keywords | Heat transfer | |
keywords | Conductivity AND Geometry | |
tree | Journal of Manufacturing Science and Engineering:;1967:;volume( 089 ):;issue: 002 | |
contenttype | Fulltext |