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contributor authorJ. K. Sinha
contributor authorH. V. Tippur
date accessioned2017-05-08T23:55:35Z
date available2017-05-08T23:55:35Z
date copyrightDecember, 1998
date issued1998
identifier issn0021-8936
identifier otherJAMCAV-26457#1032_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/119865
description abstractAn infrared interferometer capable of performing real-time full-field noncontacting deformation field measurements on optically rough surfaces is proposed as a tool for elastoplastic fracture mechanics investigations. The choice of the infrared wavelength allows interferometric measurements on fracture samples with little or no surface preparation and is more tolerant of the damage accumulation near the crack. The interferometer also bridges a sensitivity gap among existing techniques for out-of-plane deformation measurement. First, a rigorous Fourier optics analysis is provided for the interferometer and the range of surface roughness that can be studied using this interferometer is examined. The interferometer is then used for mapping deformations near elastoplastically deformed cracks in aluminum beams and solder-copper bimaterials. The regions of dominant three-dimensional effects and J-dominance are examined on the sample surface by evaluating measurements along with companion finite element analyses and the HRR fields.
publisherThe American Society of Mechanical Engineers (ASME)
titleAn Infrared Interferometer for Elastoplastic Crack-Tip Field Investigation of Homogeneous and Bimaterial Beams: A Study of Three-Dimensional Effects and J-Dominance
typeJournal Paper
journal volume65
journal issue4
journal titleJournal of Applied Mechanics
identifier doi10.1115/1.2791897
journal fristpage1032
journal lastpage1041
identifier eissn1528-9036
keywordsInterferometers
keywordsFracture (Materials)
keywordsMeasurement
keywordsDeformation
keywordsSurface roughness
keywordsFinite element analysis
keywordsFracture (Process)
keywordsFracture mechanics
keywordsOptics
keywordsWavelength
keywordsCopper
keywordsAluminum
keywordsSolders AND Surface preparation
treeJournal of Applied Mechanics:;1998:;volume( 065 ):;issue: 004
contenttypeFulltext


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