On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder

Abstract

The constitutive response of 63/37 Sn/Pb eutectic solder is studied under uniaxial tension. Stress-strain tests were performed under a wide range of applied strain rate, and creep tests were performed at several levels of applied load. Temperature dependence was ascertained by running the stress-strain and creep tests at various temperatures. With the goal of providing a constitutive description of the eutectic suitable for use in electronics packaging engineering finite element analyses, the material parameters of the phenomenological viscoplasticity model of Bodner and Partom were fit to these experiments as functions of temperature. The experiments described herein also yield important information concerning how many microstructural units must be present in a sample in order for repeatable, isotropic response to be obtained.