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    Determination of Biaxial Residual Stresses by a Holographic-Hole Drilling Technique

    Source: Journal of Engineering Materials and Technology:;1996:;volume( 118 ):;issue: 004::page 583
    Author:
    A. Makino
    ,
    E. A. Fuchs
    ,
    D. R. Williams
    ,
    D. V. Nelson
    DOI: 10.1115/1.2805960
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A technique is described for the rapid determination of residual stresses through the combined use of hole drilling and holographic interferometry. A small diameter blind hole is drilled into a part containing residual stresses and the displacement field caused by localized stress relief is registered using holographic interferometry instead of a strain gage rosette. The optical interference fringe pattern created in the hologram upon release of stress is analyzed by a fringe counting method that allows stresses to be computed quickly. A comparison of stresses determined by the holographic hole drilling technique with different known biaxial residual stresses is shown.
    keyword(s): Drilling , Residual stresses , Stress , Holographic interferometry , Displacement , Strain gages , Holography , Diffraction patterns AND Optical interference ,
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      Determination of Biaxial Residual Stresses by a Holographic-Hole Drilling Technique

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/117020
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    • Journal of Engineering Materials and Technology

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    contributor authorA. Makino
    contributor authorE. A. Fuchs
    contributor authorD. R. Williams
    contributor authorD. V. Nelson
    date accessioned2017-05-08T23:50:17Z
    date available2017-05-08T23:50:17Z
    date copyrightOctober, 1996
    date issued1996
    identifier issn0094-4289
    identifier otherJEMTA8-26981#583_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/117020
    description abstractA technique is described for the rapid determination of residual stresses through the combined use of hole drilling and holographic interferometry. A small diameter blind hole is drilled into a part containing residual stresses and the displacement field caused by localized stress relief is registered using holographic interferometry instead of a strain gage rosette. The optical interference fringe pattern created in the hologram upon release of stress is analyzed by a fringe counting method that allows stresses to be computed quickly. A comparison of stresses determined by the holographic hole drilling technique with different known biaxial residual stresses is shown.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDetermination of Biaxial Residual Stresses by a Holographic-Hole Drilling Technique
    typeJournal Paper
    journal volume118
    journal issue4
    journal titleJournal of Engineering Materials and Technology
    identifier doi10.1115/1.2805960
    journal fristpage583
    journal lastpage588
    identifier eissn1528-8889
    keywordsDrilling
    keywordsResidual stresses
    keywordsStress
    keywordsHolographic interferometry
    keywordsDisplacement
    keywordsStrain gages
    keywordsHolography
    keywordsDiffraction patterns AND Optical interference
    treeJournal of Engineering Materials and Technology:;1996:;volume( 118 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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