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contributor authorR. P. Singh
contributor authorA. Shukla
date accessioned2017-05-08T23:49:02Z
date available2017-05-08T23:49:02Z
date copyrightDecember, 1996
date issued1996
identifier issn0021-8936
identifier otherJAMCAV-26402#919_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/116358
description abstractAn experimental investigation has been conducted to study the dynamic failure of bimaterial interfaces. Interfacial crack growth is observed using dynamic photoelasticity and characterized in terms of crack-tip velocity, complex stress intensity factor, and energy release rate. On the basis of crack-tip velocity two growth regimes are established, viz. the subsonic and transonic regimes. In the latter regime crack-tip velocities up to 1.3 times the shear wave velocity of the more compliant material are observed. This results in the formation of a line of discontinuity in the stress field surrounding the crack tip and also the presence of a pseudo crack tip that travels with the Rayleigh wave velocity (of the more compliant material).
publisherThe American Society of Mechanical Engineers (ASME)
titleSubsonic and Intersonic Crack Growth Along a Bimaterial Interface
typeJournal Paper
journal volume63
journal issue4
journal titleJournal of Applied Mechanics
identifier doi10.1115/1.2787247
journal fristpage919
journal lastpage924
identifier eissn1528-9036
keywordsFracture (Materials)
keywordsStress
keywordsWaves
keywordsShear (Mechanics) AND Failure
treeJournal of Applied Mechanics:;1996:;volume( 063 ):;issue: 004
contenttypeFulltext


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