Micromechanics Modeling of Electronic CompositesSource: Journal of Engineering Materials and Technology:;1995:;volume( 117 ):;issue: 004::page 462Author:Minoru Taya
DOI: 10.1115/1.2804740Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The microstructure-macroproperty relation of electronic composites is studied by use of the Eshelby’s method which has been extended to treat the inclusion problem of thermal and electromagnetic behavior. Eshelby’s model has further been extended to the case of coupling behavior such as piezoelectric or pyroelectric behavior. When fillers embedded in the matrix are overlapped, the Eshelby’s model may not be applicable. Then one must use a percolation model, which is also discussed in this paper. Finally, the predictions based on these models are compared with experimental data to check the validity of the analytical modeling.
keyword(s): Composite materials , Micromechanics (Engineering) , Modeling , Percolation theory AND Fillers (Materials) ,
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| contributor author | Minoru Taya | |
| date accessioned | 2017-05-08T23:47:19Z | |
| date available | 2017-05-08T23:47:19Z | |
| date copyright | October, 1995 | |
| date issued | 1995 | |
| identifier issn | 0094-4289 | |
| identifier other | JEMTA8-26974#462_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115381 | |
| description abstract | The microstructure-macroproperty relation of electronic composites is studied by use of the Eshelby’s method which has been extended to treat the inclusion problem of thermal and electromagnetic behavior. Eshelby’s model has further been extended to the case of coupling behavior such as piezoelectric or pyroelectric behavior. When fillers embedded in the matrix are overlapped, the Eshelby’s model may not be applicable. Then one must use a percolation model, which is also discussed in this paper. Finally, the predictions based on these models are compared with experimental data to check the validity of the analytical modeling. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Micromechanics Modeling of Electronic Composites | |
| type | Journal Paper | |
| journal volume | 117 | |
| journal issue | 4 | |
| journal title | Journal of Engineering Materials and Technology | |
| identifier doi | 10.1115/1.2804740 | |
| journal fristpage | 462 | |
| journal lastpage | 469 | |
| identifier eissn | 1528-8889 | |
| keywords | Composite materials | |
| keywords | Micromechanics (Engineering) | |
| keywords | Modeling | |
| keywords | Percolation theory AND Fillers (Materials) | |
| tree | Journal of Engineering Materials and Technology:;1995:;volume( 117 ):;issue: 004 | |
| contenttype | Fulltext |