| contributor author | J. W. Hutchinson | |
| contributor author | T. J. Lu | |
| date accessioned | 2017-05-08T23:47:18Z | |
| date available | 2017-05-08T23:47:18Z | |
| date copyright | October, 1995 | |
| date issued | 1995 | |
| identifier issn | 0094-4289 | |
| identifier other | JEMTA8-26974#386_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115370 | |
| description abstract | Flaw-induced delamination of orthotropic laminates subject to through-thickness temperature gradients is analyzed. A crack-like flaw impedes heat flow through the laminate, producing thermal stresses and crack tip stress intensities. The focus is on delamination cracks which propagate under steady-state conditions. The steady-state analysis becomes accurate for a crack whose length is about one laminate thickness. Moreover, the analysis provides realistic fail-safe criteria for excluding delamination. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Laminate Delamination Due to Thermal Gradients | |
| type | Journal Paper | |
| journal volume | 117 | |
| journal issue | 4 | |
| journal title | Journal of Engineering Materials and Technology | |
| identifier doi | 10.1115/1.2804730 | |
| journal fristpage | 386 | |
| journal lastpage | 390 | |
| identifier eissn | 1528-8889 | |
| keywords | Laminates | |
| keywords | Delamination | |
| keywords | Temperature gradients | |
| keywords | Fracture (Materials) | |
| keywords | Steady state | |
| keywords | Thickness | |
| keywords | Stress | |
| keywords | Thermal stresses | |
| keywords | Flow (Dynamics) AND Heat | |
| tree | Journal of Engineering Materials and Technology:;1995:;volume( 117 ):;issue: 004 | |
| contenttype | Fulltext | |