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contributor authorA. E. Giannakopoulos
contributor authorK.-F. Nilsson
contributor authorG. Tsamasphyros
date accessioned2017-05-08T23:46:17Z
date available2017-05-08T23:46:17Z
date copyrightDecember, 1995
date issued1995
identifier issn0021-8936
identifier otherJAMCAV-26366#989_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/114774
description abstractThe important phenomenon of delamination buckling is examined subjected to the condition of frictionless contact. Buckled delamination is examined in particular, because in-plane compressive loading is typical and detrimental. Two types of contact can be distinguished, local and global. The latter may occur everywhere in the plate while the local contact is limited to the crack front (negative KI stress intensity factors). Both local and global contact conditions were considered using a finite element scheme which employed nonlinear plate theory. The global contact problem is formulated as it appears in post-buckling of delamination. The case of simultaneous buckling and contact is also addressed in this paper. Two particularly interesting examples of thin film delaminations are presented. In the first, the contact at buckling is due to the material anisotropy. In this case the bucking load and the post-bucking analysis were very well supported by experiments. In the second example, contact at buckling arises because of a pin that holds down the delaminated layer at its center. The treated cases indicated that contact may significantly affect the fracture parameters along the delamination front, and is, therefore, important for delamination arrest.
publisherThe American Society of Mechanical Engineers (ASME)
titleThe Contact Problem at Delamination
typeJournal Paper
journal volume62
journal issue4
journal titleJournal of Applied Mechanics
identifier doi10.1115/1.2896034
journal fristpage989
journal lastpage996
identifier eissn1528-9036
keywordsDelamination
keywordsBuckling
keywordsStress
keywordsAnisotropy
keywordsFinite element analysis
keywordsFracture (Process) AND Thin films
treeJournal of Applied Mechanics:;1995:;volume( 062 ):;issue: 004
contenttypeFulltext


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