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    Design and Fabrication of Microelectromechanical Systems

    Source: Journal of Mechanical Design:;1994:;volume( 116 ):;issue: 004::page 1081
    Author:
    S. Kota
    ,
    S. B. Crary
    ,
    K. D. Wise
    ,
    G. K. Ananthasuresh
    DOI: 10.1115/1.2919490
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An attempt has been made to summarize some of the important developments in the emerging technology of microelectromechanical systems (MEMS) from the mechanical engineering perspective. In the micro domain, design and fabrication issues are very much different from those of the macro world. The reason for this is twofold. First, the limitations of the micromachining techniques give way to new exigencies that are nonexistent in the macromachinery. One such difficulty is the virtual loss of the third dimension, since most of the microstructures are fabricated by integrated circuit based micromachining techniques that are predominantly planar. Second, the batch-produced micro structures that require no further assembly, offer significant economical advantage over their macro counterparts. Furthermore, electronic circuits and sensors can be integrated with micromechanical structures. In order to best utilize these features, it becomes necessary to establish new concepts for the design of MEMS. Alternate physical forms of the conventional joints are considered to improve the manufacturability of micromechanisms and the idea of using compliant mechanisms for micromechanical applications is put forth. The paper also reviews some of the fabrication techniques and the micromechanical devices that have already been made. In particular, it discusses the fabrication of a motor-driven four-bar linkage using the “boron-doped bulk-silicon dissolved-wafer process” developed at The University of Michigan’s Center for Integrated Sensors and Circuits.
    keyword(s): Manufacturing , Microelectromechanical systems , Design , Circuits , Sensors , Micromachining , Micromechanical devices , Silicon , Compliant mechanisms , Mechanical engineering , Engines , Dimensions , Semiconductor wafers , Integrated circuits AND Linkages ,
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      Design and Fabrication of Microelectromechanical Systems

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/113989
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    • Journal of Mechanical Design

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    contributor authorS. Kota
    contributor authorS. B. Crary
    contributor authorK. D. Wise
    contributor authorG. K. Ananthasuresh
    date accessioned2017-05-08T23:44:54Z
    date available2017-05-08T23:44:54Z
    date copyrightDecember, 1994
    date issued1994
    identifier issn1050-0472
    identifier otherJMDEDB-27622#1081_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/113989
    description abstractAn attempt has been made to summarize some of the important developments in the emerging technology of microelectromechanical systems (MEMS) from the mechanical engineering perspective. In the micro domain, design and fabrication issues are very much different from those of the macro world. The reason for this is twofold. First, the limitations of the micromachining techniques give way to new exigencies that are nonexistent in the macromachinery. One such difficulty is the virtual loss of the third dimension, since most of the microstructures are fabricated by integrated circuit based micromachining techniques that are predominantly planar. Second, the batch-produced micro structures that require no further assembly, offer significant economical advantage over their macro counterparts. Furthermore, electronic circuits and sensors can be integrated with micromechanical structures. In order to best utilize these features, it becomes necessary to establish new concepts for the design of MEMS. Alternate physical forms of the conventional joints are considered to improve the manufacturability of micromechanisms and the idea of using compliant mechanisms for micromechanical applications is put forth. The paper also reviews some of the fabrication techniques and the micromechanical devices that have already been made. In particular, it discusses the fabrication of a motor-driven four-bar linkage using the “boron-doped bulk-silicon dissolved-wafer process” developed at The University of Michigan’s Center for Integrated Sensors and Circuits.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDesign and Fabrication of Microelectromechanical Systems
    typeJournal Paper
    journal volume116
    journal issue4
    journal titleJournal of Mechanical Design
    identifier doi10.1115/1.2919490
    journal fristpage1081
    journal lastpage1088
    identifier eissn1528-9001
    keywordsManufacturing
    keywordsMicroelectromechanical systems
    keywordsDesign
    keywordsCircuits
    keywordsSensors
    keywordsMicromachining
    keywordsMicromechanical devices
    keywordsSilicon
    keywordsCompliant mechanisms
    keywordsMechanical engineering
    keywordsEngines
    keywordsDimensions
    keywordsSemiconductor wafers
    keywordsIntegrated circuits AND Linkages
    treeJournal of Mechanical Design:;1994:;volume( 116 ):;issue: 004
    contenttypeFulltext
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