contributor author | S. Chonan | |
contributor author | Y. Yuki | |
contributor author | Z. W. Jiang | |
date accessioned | 2017-05-08T23:41:58Z | |
date available | 2017-05-08T23:41:58Z | |
date copyright | December, 1993 | |
date issued | 1993 | |
identifier issn | 1050-0472 | |
identifier other | JMDEDB-27611#711_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/112288 | |
description abstract | In-plane stress distribution in a spinning free-clamped slicing blade is studied analytically. The blade is subjected to a stationary, distributed, in-plane slicing load along the inner periphery, while it is clamped and tensioned initially in the radial direction along the outer boundary. The radial, hoop, and shear stresses in the blade are given by sum of the stresses from the tensioning, spinning, and edge loading. The solution is obtained by introducing the Lâme potential functions and the two-dimensional elasticity theory. Numerical results are presented for an actual SUS301 blade cutting a 6-in.-diameter silicon ingot at 1550 rpm. Results obtained show that the contribution of the slicing load on the stress distribution is not significant; further the overall stress distribution is approximated by that of the initial tensioning except for the case of the shear stress distribution. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Stress Analysis of a Silicon-Wafer Slicer Cutting the Crystal Ingot | |
type | Journal Paper | |
journal volume | 115 | |
journal issue | 4 | |
journal title | Journal of Mechanical Design | |
identifier doi | 10.1115/1.2919259 | |
journal fristpage | 711 | |
journal lastpage | 717 | |
identifier eissn | 1528-9001 | |
keywords | Crystals | |
keywords | Semiconductor wafers | |
keywords | Stress analysis (Engineering) AND Cutting | |
tree | Journal of Mechanical Design:;1993:;volume( 115 ):;issue: 004 | |
contenttype | Fulltext | |