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    A Creep-Fatigue-Oxidation Microcrack Propagation Model for Thermomechanical Fatigue

    Source: Journal of Engineering Materials and Technology:;1992:;volume( 114 ):;issue: 003::page 282
    Author:
    M. P. Miller
    ,
    D. L. McDowell
    ,
    R. L. T. Oehmke
    DOI: 10.1115/1.2904174
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A high temperature fatigue (HTF) life prediction model is developed based on the concept of microcrack propagation. The model is used to correlate isothermal HTF and thermomechanical fatigue (TMF) life for the Ni-base superalloy MAR-M247. The mechanical strain versus temperature relationships for the TMF tests include in-phase, out-of-phase, and a counter-clockwise diamond history. The proposed model explicitly accounts for damage from all three HTF damage mechanisms: fatigue, oxidation, and creep. The fatigue and oxidation components are correlated using the ΔJ parameter with an additional time dependence included in the oxidation term. The creep component is correlated using a stress power release rate-type parameter, Ĉ. In this paper, we focus on application of a model to HTF and TMF of Ni-base superalloys. However, the basic model features may well apply to other classes of metallic materials.
    keyword(s): Creep , Fatigue , Microcracks , oxidation , Superalloys , Stress , Diamonds , Temperature , High temperature AND Mechanisms ,
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      A Creep-Fatigue-Oxidation Microcrack Propagation Model for Thermomechanical Fatigue

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/110319
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    • Journal of Engineering Materials and Technology

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    contributor authorM. P. Miller
    contributor authorD. L. McDowell
    contributor authorR. L. T. Oehmke
    date accessioned2017-05-08T23:38:34Z
    date available2017-05-08T23:38:34Z
    date copyrightJuly, 1992
    date issued1992
    identifier issn0094-4289
    identifier otherJEMTA8-26951#282_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110319
    description abstractA high temperature fatigue (HTF) life prediction model is developed based on the concept of microcrack propagation. The model is used to correlate isothermal HTF and thermomechanical fatigue (TMF) life for the Ni-base superalloy MAR-M247. The mechanical strain versus temperature relationships for the TMF tests include in-phase, out-of-phase, and a counter-clockwise diamond history. The proposed model explicitly accounts for damage from all three HTF damage mechanisms: fatigue, oxidation, and creep. The fatigue and oxidation components are correlated using the ΔJ parameter with an additional time dependence included in the oxidation term. The creep component is correlated using a stress power release rate-type parameter, Ĉ. In this paper, we focus on application of a model to HTF and TMF of Ni-base superalloys. However, the basic model features may well apply to other classes of metallic materials.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Creep-Fatigue-Oxidation Microcrack Propagation Model for Thermomechanical Fatigue
    typeJournal Paper
    journal volume114
    journal issue3
    journal titleJournal of Engineering Materials and Technology
    identifier doi10.1115/1.2904174
    journal fristpage282
    journal lastpage288
    identifier eissn1528-8889
    keywordsCreep
    keywordsFatigue
    keywordsMicrocracks
    keywordsoxidation
    keywordsSuperalloys
    keywordsStress
    keywordsDiamonds
    keywordsTemperature
    keywordsHigh temperature AND Mechanisms
    treeJournal of Engineering Materials and Technology:;1992:;volume( 114 ):;issue: 003
    contenttypeFulltext
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