| contributor author | S. Matsui | |
| contributor author | T. Horiuchi | |
| date accessioned | 2017-05-08T23:36:03Z | |
| date available | 2017-05-08T23:36:03Z | |
| date copyright | February, 1991 | |
| date issued | 1991 | |
| identifier issn | 1087-1357 | |
| identifier other | JMSEFK-27748#25_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108859 | |
| description abstract | This paper discusses substituting grinding for lapping in machining processes of silicon wafers. To attain this goal, the rotating wafer grinding method, in which a rotating wafer is ground by continuous infeed of a cup wheel, is investigated. The parallelism of a silicon wafer ground by this method is within 2 μm for a 5 in. (125 mm) wafer. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Parallelism Improvement of Ground Silicon Wafers | |
| type | Journal Paper | |
| journal volume | 113 | |
| journal issue | 1 | |
| journal title | Journal of Manufacturing Science and Engineering | |
| identifier doi | 10.1115/1.2899618 | |
| journal fristpage | 25 | |
| journal lastpage | 28 | |
| identifier eissn | 1528-8935 | |
| keywords | Semiconductor wafers | |
| keywords | Grinding | |
| keywords | Wheels AND Machining | |
| tree | Journal of Manufacturing Science and Engineering:;1991:;volume( 113 ):;issue: 001 | |
| contenttype | Fulltext | |
