| contributor author | C. T. Tsai | |
| contributor author | O. W. Dillon | |
| date accessioned | 2017-05-08T23:24:06Z | |
| date available | 2017-05-08T23:24:06Z | |
| date copyright | September, 1987 | |
| date issued | 1987 | |
| identifier issn | 0021-8936 | |
| identifier other | JAMCAV-26284#563_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/102059 | |
| description abstract | Silicon ribbon grown by the dendritic web process passes through a rapidly changing thermal profile in the growth direction. This rapidly changing profile induces stresses which cause buckling. Based on a viscoplastic material response function (Haasen-Sumino model), the creep buckling behavior of the silicon ribbon is investigated. The lateral deflection speeds describing the viscoplastic buckling behavior are calculated. It is found that the deflections of some modes increase with time while others die out. The role of the residual stresses in viscoplastic buckling is examined. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Viscoplastic Buckling of Silicon Ribbon | |
| type | Journal Paper | |
| journal volume | 54 | |
| journal issue | 3 | |
| journal title | Journal of Applied Mechanics | |
| identifier doi | 10.1115/1.3173070 | |
| journal fristpage | 563 | |
| journal lastpage | 570 | |
| identifier eissn | 1528-9036 | |
| keywords | Buckling | |
| keywords | Silicon | |
| keywords | Deflection | |
| keywords | Creep | |
| keywords | Residual stresses AND Stress | |
| tree | Journal of Applied Mechanics:;1987:;volume( 054 ):;issue: 003 | |
| contenttype | Fulltext | |
