Abstract: This paper reports the results of a study on the effect of the cooling rate during solidification on the isothermal shear-fatigue life of 60Sn/40Pb solder joints. Solder joints are made with ...

Abstract: The creep behavior of air-cooled and liquid nitrogen-quenched soldered joints of 60/40 Sn-Pb at 65°C has been studied. The stress exponent, n, in the power law, γ̇ (steady state strain ...

Abstract: Thermal reliability of the solder sealing ring of Agilent Technologies’ bubble-actuated photonic cross-connect switches has been investigated in this paper. Emphasis is placed on the determination ...