Abstract: This paper investigates the use of thermoelectric (TE) devices for thermal management of downhole electronics. The research carried out will help in the mitigation of costs associated with thermal ...

Abstract: The quality and reliability of interconnects in microelectronics is a major challenge considering the increasing level of integration and high current densities. This work studied the problem of ...

Abstract: Microprocessor performance can be significantly improved by lowering the junction temperature, especially down to the deep subambient levels. This provides the strong motivation for the current ...

Abstract: An innovative heat sink design aimed at meeting both the hot spot and large background heat flux requirements of next generation integrated circuits is presented. The heat sink design utilizes ...

Abstract: Since its inception 20 years ago, ITherm, The Intersociety Conference on Thermal, Mechanical, and Thermomechanical Phenomena in Electronic Systems, has been addressing recent advances in the area ...

Abstract: The ionic liquid butylmethylimidazolium hexafluorophosphate (bmim)(PF6 ) and five different hydrofluorocarbon refrigerants were investigated as the working fluid pairs for a waste-heat driven absorption ...

Abstract: Over upcoming electronics technology nodes, shrinking feature sizes of on-chip interconnects and correspondingly higher current densities are expected to result in higher temperatures due to ...

Abstract: It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). ...

Abstract: A technique to extract in-plane thermal conductivity of thin metallic films whose thickness is comparable to electron mean free path is described. Microscale constrictions were fabricated into ...