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RISSubmodeling Analysis for Path-Dependent Thermomechanical Problems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a finite element analysis, when localized behavior of a large model is of particular concern, generally one would refine the mesh until it captures the local solution adequately. Submodeling ...
Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to cost and process considerations, sometimes a drop-in heat spreader is incorporated in a quad flat package, which is not attached to the die pad. Consequently, due to mismatch of thermal ...
Design Guideline for Ball Impact Test Apparatus
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that ...
Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This work presents electromigration reliability and patterns of Sn–3Ag–0.5Cu and Sn–3Ag–1.5Cu∕Sn–3Ag–0.5Cu composite flip-chip solder joints with Ti∕Ni(V)∕Cu under bump metallurgy (UBM), bonded on ...
Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Plane two-dimensional finite element analysis was applied to study the effect of underfill thermomechanical properties on the potential of thermal fatigue failure for flip-chip ball grid array. ...
Effect of Test Conditions on Electromigration Reliability of Sn–Ag–Cu Flip-Chip Solder Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue ...
Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We present in this paper parametric studies of board-level reliability of wafer-level chip-scale packages subjected to a specific pulse-controlled drop test condition. Eighteen experiment cells, ...
Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Designed experiments were conducted in this paper to study the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn–3Ag–0.5Cu flip-chip solder joints ...
Micromechanical Analysis of Imperfectly Bonded Layered Media
Publisher: American Society of Civil Engineers
Abstract: The flexible interface model is adopted in this paper to analyze the three-dimensional (3D) elastic constitutive relationships, together with the local stress and strain distributions within constituent layers of an ...
Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient ...