Abstract: This paper presents a novel windage power loss (WPL) measurement method for the meshing herringbone gear pair. First, the WPL test rig of the herringbone gear pair is put up, and then the measurement sequence of WPL is ...

Abstract: Single-phase cold plate liquid cooling attracts more and more attention to high-performance computing (HPC), cloud computing, and general computing data centers for the thermal management of modern microprocessors and ...

Abstract: In order to meet the increasing performance demand of high-performance computing and edge computing, thermal design power (TDP) of central processing unit (CPU) and graphics processing unit (GPU) needs to increase. This ...

Abstract: The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is a flagship conference of ASME Electronic and Photonic Packaging Division (EPPD). It ...

Abstract: The microelectronics packaging industry is facing challenges to meet demanding performance and functional needs of modern microprocessors, radio frequency components, and power electronic devices for various product segments ...

Abstract: This study examines the factors that influence households’ location choice in the context of rapid urbanization in Hangzhou, China, where new housing and transportation infrastructure are expanding. A conditional logit ...

Abstract: Maintaining the vertical position of the conductor pipe during drilling and nondrilling operations remains a challenge in shallow-water fields. In Tianjin’s shallow-water field, a conductor pipe left for evacuation was ...

Abstract: In our former work developed by Yang et al. (2017, “Enhancing the Weak Signal With Arbitrary High-Frequency by Vibrational Resonance in Fractional-Order Duffing Oscillators,” ASME J. Comput. Nonlinear Dyn., 12(5), p. ...