Abstract: The indentation behavior of layered metal/ceramic nanocomposites was studied. The primary objective was to examine the evolving plastic deformation in the ductile metal constrained by the hard ceramic layers, during ...

Abstract: The generation of thermal stresses is a major cause for mechanical failure in encapsulated electronic components. In this study numerical modeling is employed to analyze thermal stresses in a ...

Abstract: This study is devoted to providing a mechanistic rationale of coarsening induced failure in solder alloys during thermomechanical fatigue. Micromechanical modeling of cyclic deformation of eutectic ...