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    Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling 

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004:;page 41004
    Author(s): Y. Sungtaek Ju
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Subambient temperature operations of advanced semiconductor devices offer many benefits, including improved reliability, reduced leakage currents, and enhanced signal to noise ratios. We discuss a ...
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    Impact of Interface Resistance on Pulsed Thermoelectric Cooling 

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 001:;page 14502
    Author(s): Y. Sungtaek Ju
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Pulsed thermoelectric cooling is an attractive approach for the site specific thermal management of infrared sensors and other low-heat flux devices. Intense Joule heating caused by electrical ...
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    Experimental and Numerical Study of Single Bubble Dynamics on a Hydrophobic Surface 

    Source: Journal of Heat Transfer:;2009:;volume( 131 ):;issue: 012:;page 121004
    Author(s): Youngsuk Nam; Jinfeng Wu; Gopinath Warrier; Y. Sungtaek Ju
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The growth and departure of single bubbles on two smooth surfaces with very different wettabilities are studied using high-speed video microscopy and numerical simulations. Isolated artificial ...
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    Experimental Study of Heat Conduction in Aqueous Suspensions of Aluminum Oxide Nanoparticles 

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 009:;page 92403
    Author(s): Y. Sungtaek Ju; Jichul Kim; Ming-Tsung Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We report measurements of the thermal conductivity of aqueous suspensions of aluminum oxide nanoparticles with nominal diameters of 20nm, 30nm, and 45nm and at volume concentrations up to 10%. ...
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    Characterization and Modeling of the Heat Transfer Performance of Nanostructured Cu Micropost Wicks 

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 010:;page 101502
    Author(s): Youngsuk Nam; Stephen Sharratt; Gilhwan Cha; Y. Sungtaek Ju
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Micro heat pipes incorporating advanced wicks are promising for the thermal management of power electronics. We report the heat transfer performance of superhydrophilic Cu micropost wicks fabricated ...
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    An Investigation of a Tunable Magnetomechanical Thermal Switch 

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 010:;page 101401
    Author(s): Katherine E. Bulgrin; Y. Sungtaek Ju; Greg P. Carman; Adrienne S. Lavine
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We propose a new device-level concept for a thermal switch that exploits the temperature dependence of the magnetization of a ferromagnetic material oscillating between a hot and a cold surface. ...
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