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    Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001:;page 1
    Author(s): Y. Pang; J. D. van Wyk; Z. Liang; E. Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding ...
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    Effect of Turbulent Heat Transfer on Continuous Ingot Solidification 

    Source: Journal of Engineering Materials and Technology:;1993:;volume( 115 ):;issue: 001:;page 8
    Author(s): W. Shyy; Y. Pang; G. B. Hunter; D. Y. Wei; M.-H. Chen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: For many continuous ingot casting processes, turbulent heat transfer in the molten pool plays a critical role which, along with buoyancy and surface tension, is responsible for the quality of ...
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    Field Performance of Nailed Soil Wall in Residual Soil 

    Source: Journal of Performance of Constructed Facilities:;1997:;Volume ( 011 ):;issue: 003
    Author(s): I. H. Wong; B. K. Low; P. Y. Pang; G. V. R. Raju
    Publisher: American Society of Civil Engineers
    Abstract: A soil nailing technique was used to stabilize a 9-m-deep permanent cut in residual soil for an expressway project in Singapore. This paper describes the construction details, instrumentation, and performance of the nailed ...
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    Reconfigurable Auto-ID Enabled Software as a Service (SaaS) Shell for Real-Time Fleet Management in Industrial Parks 

    Source: Journal of Computing in Civil Engineering:;2015:;Volume ( 029 ):;issue: 002
    Author(s): L. Y. Pang; Z. Li; George Q. Huang; Ray Y. Zhong; Y. Pan; T. Qu
    Publisher: American Society of Civil Engineers
    Abstract: Industrial parks, consisting of manufacturers and associated services, such as transport and warehousing, have played an important role in stimulating the economic and industrial development. Enterprises are able to share ...
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    Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM) 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004:;page 477
    Author(s): M. Hernández-Mora; J. E. González; M. Vélez-Reyes; Y. Pang; E. Scott; J. M. Ortiz-Rodrı́guez
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Background: This paper presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of an integrated power electronics module (IPEM). This model is based ...
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