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RISStress Analysis of the Vertical Interconnect for Three-Dimensional Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional (3-D) packaging is critical to developing supercompact electronic systems. Its representative configuration consists of several circuit packs connected by pressure sensitive vertical ...
Study of an Air Cooling Scheme for 3-D Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An air cooling scheme is proposed for 3-D packaging. It consists of converging, impinging, and diverging flows among stacked circuit packs. Its cooling concept is demonstrated by experimental ...
Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A three-dimensional mathematical model simulating the self-alignment mechanism in the flip-chip soldering of a single joint has been developed. Based on the principle of energy minimization, it ...
Developments of Geographic Information Systems Technology
Publisher: American Society of Civil Engineers
Abstract: The development of geographic information systems, or computer systems for managing a spatial database, has been closely linked to advances in computer technology. This paper examines the hardware and software components ...
Physical and Fuzzy Logic Modeling of a Flip-Chip Thermocompression Bonding Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flip-Chip connections using gold-to-gold, gold-to-aluminum, or gold-to-solder bondings or contacts enhanced by epoxy are low-cost alternatives to soldering. To assist their technology advancements, ...
Random Change of Vibration Modes in Thermosonic Bonding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermosonic bonding is being widely used for wire bonding and tape automated bonding (TAB). It is also being developed for flip-chip assemblies. The bonding process is sensitive to system ...
Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We study cracking from the interface of an In60-Pb40 solder joint on a brittle GaAs die when the joint is subjected to a uniform temperature change. Our primary objective is to apply and ...
Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder self-alignment is an important phenomenon enabling cost-effective optoelectronics assembly. In this study, the wetting of Sn-rich solder to under bump metallization (UBM) pads is identified ...
Correspondence Principle for Characterization of Asphalt Concrete
Publisher: American Society of Civil Engineers
Abstract: In this paper, Schapery's nonlinear elastic-viscoelastic correspondence principle based on pseudostrain concept is introduced as a means of separately evaluating important mechanisms of asphalt concrete under cyclic loading, ...
Quantitative Characterization of a Flip-Chip Solder Joint
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Based on an energy minimization principle, a mathematical/numerical model has been developed to study the impact of design and process variations associated with flip-chip solder joint on its ...