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    Local Characteristics of Convective Heat Transfer From Simulated Microelectronic Chips to Impinging Submerged Round Water Jets 

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 001:;page 71
    Author(s): H. Sun; W. Nakayama; C. F. Ma
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An experimental study was performed to investigate the local characteristics of heat transfer from vertical simulated micro-chips to impinging submerged circular water jets. The effects of jet ...
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    Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 003:;page 259
    Author(s): Y. Kondo; M. Behnia; W. Nakayama; H. Matsushima
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The study of optimization of finned heat sinks for impingement cooling of electronic components was undertaken. The procedure was based on a semiempirical zonal approach to the determination of ...
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    Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 001:;page 73
    Author(s): M. Behnia; H. Mishima; W. Nakayama; A. A. Dehghan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Natural convection immersion cooling of discrete heat sources in a series of parallel interacting open-top cavities filled with a fluorinert liquid (FC–72) has been numerically studied. A series ...
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