Abstract: In the automotive and computer industries, a perennial challenge has been to design an adequate and efficient accelerated thermal cycling test which would correspond to field service conditions. ...

Abstract: When an electronic package is subjected to thermal cycling, the solder joint interconnects are subjected to a complex stress system. If the stress is sufficiently large, the solder joint will ...

Abstract: A relatively simple numerical method was developed to determine the stress intensity factors of interfacial cracks in bimaterial systems. The method is based on the evaluation of crack tip ...

Abstract: A linear-elastic analytical model has been developed to describe the deformed geometry of a multi-layered stack assembly subject to thermal loading. The model is based on Timoshenko’s bimetal ...

Abstract: Long-term reliability of electronic packaging has become a greater challenge as a result of ever increasing power requirements and the decreasing size of electronic packages. In this study, the ...

Abstract: In this study, metal particles were added during the spot friction welding (SFW) process, a solid state sheet metal joining process, to create a localized metal matrix composite (MMC) for the ...