Abstract: When an impeller has geometrical manufacturing deviations, synchronous vibration occurs from an unbalanced hydraulic force rotating with the impeller. This phenomenon is termed “Hydraulic unbalance.” ...

Abstract: Plastic encapsulated semiconductor packages may crack at the corner regions of die pads or chips if internal delamination occurs at an elevated temperature during the reflow soldering process. ...

Abstract: ISO 10816-3 (a new standard of International Organization for Standardization) was established as vibration criteria for industrial rotating machinery based on the bearing housing vibration in ...

Abstract: Thermal conduction and mechanical stresses in through silicon via (TSV) structures in three dimensional system in package (3D SiP) under device operation condition were discussed. A large scale ...