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The Finite Element in Thermomechanics

Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 003:;page 329

Author(s): Tai-Ran Hsu; J. H. Lau

Publisher: The American Society of Mechanical Engineers (ASME)

Special Issue on Mechanics of Surface Mount Assemblies

Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002:;page 139

Author(s): Donald Barker; Hans Conrad; Peter Engel; Tai-Ran Hsu; John Lau; Yi-Hsin Pao; Anthony Rafanelli; Harvey Solomon; Donald Stone; Frank Wu

Publisher: The American Society of Mechanical Engineers (ASME)

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The Finite Element in Thermomechanics

Special Issue on Mechanics of Surface Mount Assemblies

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The Finite Element in Thermomechanics

Special Issue on Mechanics of Surface Mount Assemblies