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PCB Trace Thermal Analysis and Effective Conductivity
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The electrical current carrying capability of a surface or buried trace located within a fiberglass printed circuit board (PCB), is of important interest in the microelectronics industry. The ...
Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The need to accurately predict component junction temperatures on fully operational printed circuit boards can lead to complex and time consuming simulations if component details are to be ...