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RISInterfacial Fracture Toughness Measurement of a Ti/Si Interface
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Titanium adhesive layers are commonly used in microelectronic and MEMS applications to help improve the adhesion of other metal layers to a silicon substrate. Such Ti/Si interfaces could potentially ...
Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The presence of dissimilar material systems and thermal gradients introduce thermal stresses in multi-layered electronic assemblies and packages during fabrication and operation. The high stress ...
Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder joint fatigue failure under vibration loading continues to be a concern in microelectronic industry. Existing literature has not adequately addressed high-cycle fatigue failure of high-lead ...
An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Although accelerated thermal cycling has been widely used in electronics industry to qualify electronic packages, efforts to reduce the time and cost associated with such qualification techniques ...
Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Advances in integrated circuit fabrication have created a need for an innovative, inexpensive, yet reliable probing technology with ultra-fine pitch capability. Research teams at Georgia Tech, ...
Development of G-Helix Structure as Off-Chip Interconnect
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Microsystem packages continue to demand lower cost, higher reliability, better performance and smaller size. Compliant wafer-level interconnects show great potential for next-generation packaging. ...
Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermal efficacy of thermal interface material (TIM) is highly dependent on its ability to adhere to the surfaces of interest. Any delamination of the TIM from the die or the lid will ...
Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A field-use induced damage mapping methodology is presented that can take into consideration the field-use thermal environment profile to develop accelerated thermal cycling guidelines for packages ...
Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: No-flow underfill materials reduce assembly processing steps and can potentially be used in fine-pitch flip chip on organic board assemblies. Such no-flow underfills, when filled with nano-scale ...
Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The occurrence of passivation-underfill interfacial delamination is detrimental to the reliability of the flip chip assembly as it can result in the premature cracking of the solder bumps. In ...