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    Improved Efficiency of Dye-Sensitized Solar Cells Using a Vertically Aligned Carbon Nanotube Counter Electrode 

    Source: Journal of Solar Energy Engineering:;2010:;volume( 132 ):;issue: 002:;page 21007
    Author(s): Robert A. Sayer; Stephen L. Hodson; Timothy S. Fisher
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Dye-sensitized solar cells (DSSCs) offer many advantages in comparison to their Si-based counterparts, including lower cost of raw materials, faster manufacturing time, and the ability to be ...
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    Heat Transfer Across Metal-Dielectric Interfaces During Ultrafast-Laser Heating 

    Source: Journal of Heat Transfer:;2012:;volume( 134 ):;issue: 004:;page 42402
    Author(s): Liang Guo; Stephen L. Hodson; Timothy S. Fisher; Xianfan Xu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Heat transfer across metal-dielectric interfaces involves transport of electrons and phonons accomplished either by coupling between phonons in metal and dielectric or by coupling between electrons ...
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    Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces 

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002:;page 20907
    Author(s): Stephen L. Hodson; Thiruvelu Bhuvana; Baratunde A. Cola; Xianfan Xu; G. U. Kulkarni; Timothy S. Fisher
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which ...
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    Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique 

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 002:;page 20901
    Author(s): Joseph R. Wasniewski; Stephen L. Hodson; Anuradha Bulusu; Samuel Graham; Timothy S. Fisher; David H. Altman; Baratunde A. Cola
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured ...
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