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RISA Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper deals with the thermal management of a TBGA chip carrier package. In TBGA packages the backside of the chip is available for heat sink or heat spreader (cover plate) attach. By ...
A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages ...