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    Letter From the Editors 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003:;page 30201
    Author(s): Sammakia, Bahgat G.; Lee, Y. C.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: During the last ten years, it was a great pleasure working with the many outstanding AEs who served the JEP, the ASME staff, and with Mr. Gary Miller. Thanks to all of us working as a team, we were able to get the JEP to ...
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    Review and Analysis of Cross Flow Heat Exchanger Transient Modeling for Flow Rate and Temperature Variations 

    Source: Journal of Thermal Science and Engineering Applications:;2015:;volume( 007 ):;issue: 004:;page 41017
    Author(s): Gao, Tianyi; Geer, James; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Heat exchangers are important facilities that are widely used in heating, ventilating, and air conditioning (HVAC) systems. For example, heat exchangers are the primary units used in the design of the heat transfer loops ...
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    A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction 

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 004:;page 41008
    Author(s): Chen, Cheng; Geer, James; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
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    Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41101-1
    Author(s): Gharaibeh, Ahmad R.; Soud, Qusai; Manaserh, Yaman; Tradat, Mohammad; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The variety of new electronic packaging technologies has grown significantly over the last 20 years as a result of market demands for higher device performance at lower costs and in less space. Those demands have pushed ...
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    Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment 

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 002:;page 21010
    Author(s): Alkharabsheh, Sami A.; Sammakia, Bahgat G.; Shrivastava, Saurabh K.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents the results of an experimentally validated computational fluid dynamics (CFD) model for a data center with fully implemented fan curves on both the servers and the computer room air conditioner (CRAC). ...
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    Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers 

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 002:;page 21007
    Author(s): Gao, Tianyi; Sammakia, Bahgat; Samadiani, Emad; Schmidt, Roger
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Data centers consume a considerable amount of energy which is estimated to be about 2% of the total electrical energy consumed in the U.S. in the year 2010, and this number continues to increase every year. Thermal management ...
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    Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density 

    Source: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 003:;page 31006
    Author(s): Zhang, Tingting; Sammakia, Bahgat G.; Yang, Zhihao; Wang, Howard
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We have investigated a novel hybrid nanocomposite thermal interface material (TIM) that consists of silver nanoparticles (AgNPs), silver nanoflakes (AgNFs), and copper microparticles (CuMPs). Continuous metallic network ...
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    Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks 

    Source: Journal of Electronic Packaging:;2020:;volume( 143 ):;issue: 002:;page 021007-1
    Author(s): Hadad, Yaser; Radmard, Vahideh; Rangarajan, Srikanth; Farahikia, Mahdi; Refai-Ahmed, Gamal; Chiarot, Paul R.; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The industry shift to multicore microprocessor architecture will likely cause higher temperature nonuniformity on chip surfaces, exacerbating the problem of chip reliability and lifespan. While advanced cooling technologies ...
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    Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal Collector and Thermoelectric Generators 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 004:;page 41004
    Author(s): Xu, Xinqiang; Zhou, Siyi; Meyers, Mark M.; Sammakia, Bahgat G.; Murray, Bruce T.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermoelectric (TE) modules utilize available temperature differences to generate electricity by the Seebeck effect. The current study investigates the merits of employing thermoelectrics to harvest additional electric ...
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    A Brief Overview of Recent Developments in Thermal Management in Data Centers 

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 004:;page 40801
    Author(s): Alkharabsheh, Sami; Fernandes, John; Gebrehiwot, Betsegaw; Agonafer, Dereje; Ghose, Kanad; Ortega, Alfonso; Joshi, Yogendra; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Data centers are mission critical facilities that typically contain thousands of data processing equipment, such as servers, switches, and routers. In recent years, there has been a boom in data center usage, leading their ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian